Product Overview

Dual 5.0MP Lens Camera Module is a dual-sensor USB camera module featuring two 5MP CMOS image sensors, USB 2.0 interface, and UVC compatibility. It captures synchronized high-resolution images for stereo vision, AI imaging, biometric authentication, industrial inspection, and embedded vision applications.

Specification

Camera
Signal		5M IR			5M HDR
Image Sensor		1/2.5" CMOS			1/2.5" CMOS
Maximum Frame Rates		2592x1944 at 30fps 2560x1440 at 30fps 2048x1536 at 30fps 1920x1080 at 30fps 1600x1200 at 30fps 1280x960 at 30fps 1280x720 at 30fps 1024x768 at 30fps 800x600 at 30fps 640x480 at 30 fps 352x288 at 30 fps 320x240 at 30 fps 160x120 at 30 fps			2592x1944 at 30fps 2560x1440 at 30fps 2048x1536 at 30fps 1920x1080 at 30fps 1600x1200 at 30fps 1280x960 at 30fps 1280x720 at 30fps 1024x768 at 30fps 800x600 at 30fps 640x480 at 30 fps 352x288 at 30 fps 320x240 at 30 fps 160x120 at 30 fps
Maximum Frame Rates		2592x1944 at 3fps 2560x1440 at 3fps 2048x1536 at 3fps 1920x1080 at 3fps 1600x1200 at 5fps 1280x960 at 5fps 1280x720 at 5fps 1024x768 at 10fps 800x600 at 20fps 640x480 at 30 fps 352x288 at 30 fps 320x240 at 30 fps 160x120 at 30 fps			2592x1944 at 3fps 2560x1440 at 3fps 2048x1536 at 3fps 1920x1080 at 3fps 1600x1200 at 5fps 1280x960 at 5fps 1280x720 at 5fps 1024x768 at 10fps 800x600 at 20fps 640x480 at 30 fps 352x288 at 30 fps 320x240 at 30 fps 160x120 at 30 fps
Encryption Algorithms		SM2			Signature ≥ 50 times/second
					Verification ≥ 30 times/second
		SM3			≥1.5Mbps
		SM4			≥1.5Mbps
		SM1,RSA1024,RSA2048,SHA256
SNR max		39dB			39dB
Dynamic range		85dB			85dB
Min. Illumination		0.1LUX at F1.2			0.1LUX at F1.2
FOV		H:69°V:54°@2592x1944			H:69°V:54°@2592x1944
Digital interface		5-pin 1.25mm USB2.0
Transfer rates		480Mbps			480Mbps
Power requirements		5V±5%
Power Consumption		Max 1W			Max 1W
Dimensions (PCBA)mm		80X16mm
Weight		TBD
Operating temperature(℃)		-25~60 ℃
Storage temperature(℃)		-55~85 ℃/0~90RH
Lens view		4.35mm
Compliance		USB-IF WHQL CE RoHS
OS		Windows XP /vista/seven/8.1/Mac linux2.6.2(include UVC )/ Andriod5.1
USB
	J1		J2	I/O		NOTE
1	5V		5V	USB POWER		500mA max
2	DM		DM	-		D-
3	DP		DP	-		D+
4	GND		GND	-		DGND

Core Technologies

Dual CMOS Imaging Technology - Uses two synchronized image sensors to support stereo vision, image comparison, and multi-camera applications.
USB Video Class (UVC) - Eliminates custom driver development for faster integration on major operating systems.
HDR Image Processing - Improves visibility in challenging lighting environments by balancing bright and dark image areas.
Low-Light Imaging Technology - Maintains image usability under low illumination through optimized sensor performance.
Hardware Cryptographic Engine - Supports SM2, SM3, SM4, RSA, and SHA256 algorithms for secure imaging and identity-related applications.

Typical Applications

Biometric Authentication - Captures dual-camera facial images for identity verification systems.
AI Vision Devices - Provides synchronized image input for AI recognition and edge vision processing.
Industrial Machine Vision - Supports product inspection, positioning, and automated quality control.
Access Control Systems - Integrates into secure entry terminals requiring dual-camera imaging.
Medical Imaging Equipment - Supplies high-resolution image acquisition for diagnostic and analytical devices.

OEM & Customization

Hardware Customization

Sensor configuration (IR + HDR, RGB + IR, Dual RGB, or customized combinations)
Lens focal length (2.8mm, 3.6mm, 4.35mm, 6mm, 8mm, etc.)
Field of View (wide-angle, standard, narrow-angle)
PCB dimensions and mounting hole layout
USB connector type (Type-A, Type-C, Micro USB, customized cable)
Microphone integration
LED fill light or IR LED configuration
Interface cable length
Housing or board-level design
Connector customization

Software Customization

Image parameter tuning
Exposure and white balance optimization
HDR parameter adjustment
Image flip and mirror settings
Resolution and frame rate configuration
UVC firmware customization
Linux, Windows and Android driver support
SDK/API integration support
Encryption algorithm configuration

Branding Customization

OEM logo printing
Private label packaging
Customized product labels
Barcode and serial number printing
User manual customization
Retail or industrial packaging design

Quality Assurance

Incoming Material Inspection (IQC)

CMOS sensor verification
PCB dimensional inspection
Lens optical inspection
Electronic component verification

In-Process Quality Control (IPQC)

SMT solder joint inspection (AOI)
PCB electrical continuity testing
Optical alignment inspection
Firmware programming verification

Final Quality Control (FQC)

Resolution verification
Frame rate validation
USB communication test
Image noise (SNR) measurement
Dynamic range verification
Color consistency test
Low-light imaging test
Focus accuracy inspection
Power consumption measurement
Aging test (Burn-in)
Functional verification under operating temperature
Final appearance inspection

Certifications

Certification	Meaning
USB-IF	Compliance with USB interface specifications for interoperability.
WHQL	Microsoft Windows Hardware Quality Labs certification for Windows compatibility.
CE	Conforms to applicable EU safety, EMC, and environmental requirements.
RoHS	Restricts hazardous substances used in electronic products.

FAQ

Q: Do you provide SDKs or development support?

A: Yes. We provide technical documentation, integration guidance, sample code where applicable, and engineering support for OEM projects.

Q: How do I choose between the IR and HDR versions?

A: The IR version is suitable for infrared-assisted imaging or biometric applications, while the HDR version is better suited for environments with significant lighting contrast.

Q: Are samples available before mass production?

A: Yes. Sample orders are available for evaluation, prototype development, and compatibility testing.

Q: What is the standard production lead time?

A: Sample orders are typically shipped within 7–15 working days. Mass production generally requires about 30 days, depending on order quantity and production schedule.

Q: How are the products packaged for shipment?

A: Each module is packed in ESD protective packaging, then placed in anti-static trays or cartons designed for international transportation.

Q: What payment methods do you accept?

A: We accept T/T, PayPal, Western Union, Alipay, and MoneyGram. Payment terms can be discussed for long-term cooperation.

Q: Which export documents can you provide?

A: We can provide Commercial Invoice, Packing List, Bill of Lading/Air Waybill, Certificate of Origin, CE/RoHS declarations (where applicable), and other export documents according to destination country requirements.

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